Method and device for the simultaneous coating and moulding...

Details Method and device for the simultaneous coating and moulding... Method and device for the simultaneous coating and moulding...

2002-08-07

2010-06-29

Huson, Monica A (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Reactive gas or vapor treatment of work

Work is organic material

C264S084000, C264S500000, C264S328100, C425S529000

Reexamination Certificate

active

07744790

ABSTRACT:
A process for simultaneously coating and forming a body. The process includes moving two mold halves into contact with one another; introducing an injection-molding material into the mold halves so that a molding is formed; evacuating the molding; admitting a gas into the molding; igniting a plasma in the molding so that a coating is deposited on the inner side of the molding; and moving the mold halves apart so that the molding drops out.

REFERENCES:
patent: 4114369 (1978-09-01), Crowley
patent: 4265730 (1981-05-01), Hirose et al.
patent: 4880675 (1989-11-01), Mehta
patent: 5378510 (1995-01-01), Thomas et al.
patent: 5458480 (1995-10-01), Newkirk et al.
patent: 5560963 (1996-10-01), Tisack
patent: 5798139 (1998-08-01), Nagashima et al.
patent: 5833752 (1998-11-01), Martin
patent: 6001429 (1999-12-01), Martin
patent: 6565791 (2003-05-01), Laurent
patent: 195 02 103 (1995-08-01), None
patent: 1 029 648 (2000-08-01), None
patent: 1 029 648 (2002-07-01), None
patent: 62130823 (1987-06-01), None
patent: WO 99/17334 (1999-04-01), None

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