Method and device for the introduction of planar substrates...

Details Method and device for the introduction of planar substrates... Method and device for the introduction of planar substrates...

2007-09-11

2007-09-11

Mackey, Patrick (Department: 3652)

Material or article handling

Process

Of moving intersupporting articles into, within, or from...

C414S789500, C414S793000, C414S793100

Reexamination Certificate

active

10494773

ABSTRACT:
One embodiment of the invention is a method for placing circuit boards in a receiving container, comprising the following steps: a) gripping and lifting a circuit board with a first grappling device, b) moving the first grappling device and the receiving container relative to each other, such that the receiving container is located below the first grappling device, c) the first grappling device lowers the circuit board into the receiving container, d) gripping and lifting a partition layer from a dispenser with a second grappling device, e) reversion to step b), such that the receiving container is accessible from above and is below the second grappling device, f) the partition layer is placed in the receiving container on top of the previously placed circuit board and g) start the process at a).

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International Search Report dated Apr. 11, 2003 (5 pages).

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