Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – Moving tool electrode
Patent
1998-09-29
2000-06-06
Phasge, Arun S.
Electrolysis: processes, compositions used therein, and methods
Electrolytic erosion of a workpiece for shape or surface...
Moving tool electrode
205687, 205125, 204198, 204226, B23H 500
Patent
active
06071400&
DESCRIPTION:
BRIEF SUMMARY
This application is a National Stage Application of PCT/EP97/01544 filed Mar. 26, 1997.
The invention relates to a method for the electrochemical treatment of an item to be treated with treatment liquid and also to a device for carrying out the procedure.
In order to produce circuit boards, conductive structures, the conductor lines, must be formed on their surfaces. The latter represent mutually insulated islands which can be treated selectively.
The structures on the item to be treated, for example on circuit boards, must have, however, an electrically conductive connection respectively to the bath current source during treatment since electrochemical treatment of an item to be treated fundamentally presupposes that the surfaces to be treated are electrically conductive. In known electrochemical methods for treating structures on circuit boards therefore, a completely electroplated and, if necessary, through hole plated circuit board which is electrolytically reinforced with copper is assumed. The structures are deposited onto the circuit boards, which are so prepared, by printing or in a photographic manner, for example, with a negative image of the structure. Subsequently, the non-masked, electrically conductive surfaces are treated electrochemically in a selective manner. As a rule, several procedural steps are required here. Finally, the electrically conductive layer between the structures must be completely removed by etching. The etching process is performed preferably in chemical baths using splashing and spraying techniques.
A disadvantage in this procedure is that the item to be treated must be placed twice into a wet-chemical treatment production line: firstly, the circuit boards are through hole plated. Then, the boards are printed with the structure image out with the wet area and subsequently they are inserted once again into a wet-chemical treatment production line for treating the structures. Corresponding rinsing and drying processes are necessary. Furthermore, it is disadvantageous that the conductive base layer between the structures cannot be removed until the conductor lines have been manufactured. For this purpose, the surfaces of the conductor lines must be provided with additional protection so that they are not damaged during the etching process.
The same is true for the production of inner layers of multi-layer courses. In order to prevent two-fold insertion into the wet-chemical treatment production lines (electrochemical all-over treatment of the surface, removal, printing and subsequently further treatment with wet-chemical methods), the untreated holohedral copper surfaces can also be printed first. Then the etching process and the further selective surface treatment can be carried out in a chemical manner. The remaining copper surfaces, which represent electrically insulated islands after etching, are oxidised brown or black in order to improve the adhesion while pressing several inner layers of this type by known methods onto the surfaces. Subsequently, the surfaces are chemically reduced to improve the corrosion properties. These chemical processes are time-consuming and very expensive as a consequence of a continual high consumption of chemicals and the disposal of large amounts of spent chemicals. In contrast, the electrochemical processes for oxidisation or reduction of the copper surfaces have considerable advantages when compared to purely chemical treatment.
In the publication DE 43 37 988 A1, a method for producing multi-layer inner layers is described. It is suggested here, that the oxidised copper surfaces be electrochemically reduced in a horizontal through-put unit. A salt solution, for example, should be used as an electrolyte. The oxidised surfaces are electrically contacted with cathodic polarity via one or two pairs of rollers per multi-layer layer, while the structures are joined electrically to the bath current source via the rollers. The anodes are arranged in such a way that the item to be treated can be directed through between the latter. By means of e
REFERENCES:
patent: 4093520 (1978-06-01), Koontz et al.
patent: 4359366 (1982-11-01), Eidschun
patent: 5114558 (1992-05-01), Kadija
patent: 5194126 (1993-03-01), Packalin
Kopp Lorenz
Rydlewski Thomas
Schneider Reinhard
Schroder Rolf
Steffen Horst
Atotech Deutschland GmbH
Phasge Arun S,.
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