Method and device for the comminution of semiconductor material

Solid material comminution or disintegration – Processes

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241 15, 241 39, B02C 1906

Patent

active

056603355

ABSTRACT:
A method for the contamination-free comminution of semiconductor material cludes an apparatus by which the method is carried out. The method includes creating at least one liquid jet by applying pressure to a liquid and forcing it through a nozzle, and directing the liquid jet against the semiconductor material, so that it impinges on its surface at high velocity. The apparatus includes a container for receiving comminuted semiconductor material, at least one nozzle through which a liquid jet is directed at high velocity against the semiconductor material to be comminuted, a conveyor device for removing the comminuted semiconductor material from the container, means for releasing and interrupting the liquid jet, and means for positioning the nozzle and/or advancing the semiconductor material.

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patent: 4323198 (1982-04-01), Turner et al.
patent: 4723715 (1988-02-01), Mazurkiewicz
patent: 4871117 (1989-10-01), Baueregger et al.
patent: 4986479 (1991-01-01), Swarden et al.
patent: 5123599 (1992-06-01), Mardigian
patent: 5346141 (1994-09-01), Kim et al.

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