Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-06-15
2011-10-11
Dinh, Tuan T (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S764000, C361S767000
Reexamination Certificate
active
08035988
ABSTRACT:
The present invention provides methods and systems for repeatably creating and severing a short circuit to protect an electronic component from ESD. A short circuit may be formed between read sensor pads of a read sensor by depositing a shorting material on a magnetic head using a Laser Induced Forward Transfer (LIFT) process. The short circuit may be unshorted using a laser scan configured to sever the shorting material. In one embodiment, a shorting station may be provided to prevent spreading of the shorting material to undesired areas of the electronic component.
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K.M.A. Rahman, D.N. Wells and M.T. Duignan, Laser Direct-Write of Materials for Microelectronics Applications, presented at Symposium V: Materials Development for Direct Write Technologies (Materials Research Society Spring 2000 Program), Apr. 26, 2000, San Francisco, CA.
Fontana, Jr. Robert E.
Kiselev Sergey
Lee Edward Hin Pong
Mackay Kenneth Donald
Pattanaik Surya Narayan
Dinh Tuan T
Hitachi Global Storage Technologies - Netherlands B.V.
Patterson & Sheridan LLP
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