Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2005-09-20
2005-09-20
Kornakov, M. (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S001300, C134S003000, C134S026000, C134S030000, C438S906000
Reexamination Certificate
active
06946036
ABSTRACT:
The method for removing particles that adhere to the surface of semiconductor wafers is constituted so as to sequentially carry out a first cleaning process in which semiconductor wafers100are cleaned for a prescribed time in cleaning tank104containing a first cleaning solution consisting of ozone water, and, after said first cleaning process, a second cleaning process in which said semiconductor wafers100are cleaned for a prescribed time in cleaning tank106containing a second cleaning solution consisting of hydrogen water.
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Fube Minoru
Nakayama Kazutaka
Tsuga Toshihito
Brady III W. James
Kornakov M.
McLarty Peter K.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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