Method and device for removing a semiconductor wafer from a flat

Details Method and device for removing a semiconductor wafer from a flat Method and device for removing a semiconductor wafer from a flat

1997-10-21

1999-09-14

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438745, 156345, H01L 2100

Patent

active

059522429

ABSTRACT:
A means for removing a semiconductor wafer from a flat substrate uses a device for removing a semiconductor wafer from a polishing cloth of a double side polishing machine. The method has a liquid being pressed through the substrate against the semiconductor wafer lying on the substrate, such that the semiconductor wafer is lifted up from the substrate by the action of the liquid. Then the wafer is picked up by a pick-up device.

REFERENCES:
patent: 5494862 (1996-02-01), Kato et al.
patent: 5527209 (1996-06-01), Volodarsqy et al.
Patent Abstracts of Japan, vol. 011, No. 344 (M-640) & JP 62 124844 A (Hihi Ltd).
Patent Abstracts of Japan, vol. 097, No. 001 & JP08229807A (Fusiuoshi Mach Corp).

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