Method and device for releasing cathode plates

Metal working – Method of mechanical manufacture – Disassembling

Patent

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Details

225 98, 204281, 204227, B23P 1900, B26F 300, C25D 100, C25D 1700

Patent

active

060790938

DESCRIPTION:

BRIEF SUMMARY
TECHNICAL FIELD

The invention relates to a method and a device for releasing electrolytically deposited cathode plates from each side of a mother plate.


BACKGROUND OF THE INVENTION

In electrolytical refining of copper and other metals, cathode plates are deposited on each side of mother plates. According to a technique used in the past, a comparatively thin layer is deposited on the mother plate, so called starting sheets, which may have a thickness up to approximately 1 mm. The starting sheets are stripped form the mother plates and are used in a subsequent stage as cathodes, in order to be coated with more electrolytically deposited metal to a full thickness. According to modem technique, however, no starting sheets are produced. Instead, the electrolytically deposited metal is accumulated to the intended full thickness on the original mother plate, which may consist e.g. of stainless acid resistant steel, titanium or other metal, according to so called full deposit technique.
Whether it is the question of starting sheet production or of full deposit technique, one has encountered problems in connection with the stripping of the deposited cathode plates from the mother plate. Various methods have been employed, including the application of bending forces, impacts, vibrations, etc., but no ideal method so far has been suggested in prior art. Either the suggested and/or employed methods have not been sufficiently efficient or have caused damages on the mother plates or on other equipment. Therefore, there exists a need to solve these problems in a better mode than according to the technique of today.


BRIEF DISCLOSURE OF THE INVENTION

It is the purpose of the invention to solve the above mentioned problems. Characteristic features and aspects of the invention are apparent from the following description of a preferred embodiment.
According to the invention at least one roller is pressed to the surface of the deposited cathode plate and that roller is moved a distance along the surface of the deposited cathode plate. The distance at which the roller will press the cathode plate is between 0 and 50 mm, preferably not more than 15 mm from the upper edge of the cathode plates. The roller pressed against the cathode plate, is moved a distance, the total length of which corresponds to 20 to 100% of the length of the plate assembly, preferably 40 to 80% of the length of the plate assembly. The pressing and the movement cause the release of the deposited cathode plate from the mother plate at least in the rolled area. The deposited cathode plate is then completely released from the mother plate in the stripping operation proper.
The pressing can be carried out by at least one roller pair with the rollers positioned on the opposite side of the plate assembly. Then the rollers are pressed towards each other with the plate assembly between them and they are syncronously moved a rolling distance in the region of an edge part of the cathode plate. The cathode plates are disengaged from the mother plate at least in that edge portion of the cathode plates. It is also possible to use in accordance with the invention two roller pairs, one pair on one side of the plate assembly and the other at the opposite side of the plate assembly so that the roller pair are moved under pressure in opposite directions from each other. These two roller pairs can also be used so that the roller pairs are moved away from each other from the central starting positions in directions towards the outer edges of the plate assembly.


BRIEF DESCRIPTION OF THE DRAWINGS

In the following description of a preferred embodiment, reference will be made to the accompanying drawings, in which
FIG. 1 is a side elevation of the device according to the preferred embodiment,
FIG. 2 is a view along the line II--II in FIG. 1, and
FIG. 3 is a view along the line III--III in FIG. 2.


DESCRIPTION OF A PREFERRED EMBODIMENT

In the drawings, a mother plate is generally designated by numeral 1. The mother plate is secured to a cathode rod 2, which is suspended

REFERENCES:
patent: 4027378 (1977-06-01), Wennberg et al.
patent: 5376062 (1994-12-01), Zeichner
patent: 5828647 (1998-10-01), Lee et al.

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