Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2005-09-20
2005-09-20
Tran, Minhloan (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S118000, C438S458000, C257S620000
Reexamination Certificate
active
06946326
ABSTRACT:
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
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Courage David S.
Harney Kieran P.
Martin John R.
Spooner Timothy R.
Analog Devices Inc.
Dickey Thomas L
Gauthier & Connors LLP
Tran Minhloan
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