Method and device for protecting micro electromechanical...

Details Method and device for protecting micro electromechanical... Method and device for protecting micro electromechanical...

2005-09-20

2005-09-20

Lebentritt, Michael (Department: 2829)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S110000, C438S462000, C438S464000

Reexamination Certificate

active

06946366

ABSTRACT:
A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

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