Method and device for processing substrate

Details Method and device for processing substrate Method and device for processing substrate

2005-06-07

2005-06-07

Jolley, Kirsten (Department: 1762)

Coating processes

Centrifugal force utilized

C427S425000, C118S052000, C438S758000, C414S800000, C414S806000, C414S935000

Reexamination Certificate

active

06902762

ABSTRACT:
A substrate processing method comprises stopping the transfer of a head substrate of a succeeding lot for a period which is an integral multiple of a cycle time after a last substrate of a preceding lot is transferred from a cassette section to a processing section by a transfer mechanism, executing dummy dispense of a predetermined time by a solution processing unit during the substrate transfer stop period, and transferring the head substrate of the succeeding lot to the processing section by the transfer mechanism after the dummy dispense.

REFERENCES:
patent: 4982694 (1991-01-01), Moriyama
patent: 5127362 (1992-07-01), Iwatsu et al.
patent: 5815762 (1998-09-01), Sakai et al.
patent: 6338582 (2002-01-01), Ueda
patent: 5-190436 (1993-07-01), None
JPO computer translation of JP 5-190436 A, published Jul. 1993.

Affiliated with

Also associated with

Rating

Method and device for processing substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and device for processing substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and device for processing substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3509130