Method and device for processing semiconductor wafer

Details Method and device for processing semiconductor wafer Method and device for processing semiconductor wafer

2006-02-14

2006-02-14

Picard, Leo (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S121000, C700S112000

Reexamination Certificate

active

06999830

ABSTRACT:
A method of processing a semiconductor wafer including the steps of executing a permutation processing by using a plurality of processing containers while sequentially transferring the wafers into the containers or performing a parallel processing and a transfer mechanism used commonly for the containers while sequentially transferring the wafers. The wafer processing is performed after the completion of conditioning of the vessel, and a conditioning start time for a next container is adjusted so that the completion of conditioning occurs when processing in the previous container is completed.

REFERENCES:
patent: 5943230 (1999-08-01), Rinnen et al.
patent: 6535784 (2003-03-01), Joma et al.
patent: 6694218 (2004-02-01), Oh
patent: 7-335616 (1995-12-01), None

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