Method and device for processing individual integrated circuits

Details Method and device for processing individual integrated circuits Method and device for processing individual integrated circuits

1983-08-18

1984-10-02

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

29740, 29577C, 29589, 156299, 156562, B01J 1700

Patent

active

044746393

ABSTRACT:
For the purpose of processing individual, integrated circuits into film-mounted, integrated circuits (micropacks), a plate having recesses exhibiting the size of the individual chips disposed matrix-like is secured to a highly plane-parallel carrier plate consisting of material exhibiting poor thermal conductivity, the individual chips are placed in the recess of said plate, and the overall arrangement is further processed in an automatic contacting machine in a known manner.

REFERENCES:
patent: 3634930 (1972-01-01), Cranston
patent: 3689955 (1972-09-01), Nier
patent: 3859723 (1975-01-01), Hamer et al.
patent: 3887996 (1975-06-01), Hartleroad
patent: 3931922 (1976-01-01), Jackson

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