Method and device for positioning and retaining micro-building-b

Details Method and device for positioning and retaining micro-building-b Method and device for positioning and retaining micro-building-b

1997-10-20

2000-10-24

Picard, Leo P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

257666, 257731, 257732, 361752, 361758, 361759, H01L 2342, H01L 2160

Patent

active

061371726

ABSTRACT:
In order to simplify handling and mounting of chips or chip-like structures/micro-blocks, a method and a device have been developed, by which, depending on the area of use, one or more chips can be assembled to act together and/or act together with other chip-like structures such as micromechanical building elements or microoptical elements. The actual retention of a micro-building-block (1) is achieved by micromechanical tongues (4) acting across holes or cavities (2) in a carrier material (3). Silicon tongues can, for example, be both flexible and sufficiently strong to retain a chip. In this manner, there is assured both precise vertical and horizontal positioning and mechanical retention. Electrical connection to the chip can be effected either by thin film technology or by more conventional wire-bonding.

REFERENCES:
patent: 3568012 (1971-03-01), Ernst
patent: 4433886 (1984-02-01), Cassarly et al.
patent: 4435724 (1984-03-01), Ralstin
International-Type Search Report corresponding to Application No. SE 9603864-1, mailed Jul. 25, 1997.

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