Method and device for positioning and accessing a die under anal

Details Method and device for positioning and accessing a die under anal Method and device for positioning and accessing a die under anal

1998-06-05

2000-10-31

Eley, Timothy V.

Abrading

Abrading process

Glass or stone abrading

451 54, 451 55, 451 57, 451 58, B24B 100

Patent

active

061394033

ABSTRACT:
A method and device which is provided for thinning flip chip bonded integrated circuit (IC) devices with better accuracy. The method and device permit a successful approach to one portion of the circuit while leaving other portions of the circuit intact. Thus, other portions of the circuit can be the subject of later analysis or can be modified as debugging may require. The method and device provide the above stated capability in an effective and efficient manner.

REFERENCES:
patent: 5930598 (1999-07-01), Willie et al.
patent: 5959363 (1999-09-01), Yamada et al.

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