Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-10-03
1993-06-08
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29740, 29832, H05K 330, B23P 1900
Patent
active
052168042
ABSTRACT:
A method of placing a component on a printed circuit board by means of a manipulator and a device suitable for carrying out this method, whereby the position of the component is determined with an imaging device. The imaging device makes a picture of the component and of a reference member coupled to the manipulator. The position of the component relative to the manipulator can be directly determined from this picture. The positions of the manipulator and the component relative to the imaging device may also be determined. Using the so determined component position, the component is placed on a printed circuit board in a given orientation so that the component leads are inserted into mating holes in the printed circuit board.
REFERENCES:
patent: 4553843 (1985-11-01), Langley et al.
patent: 4644642 (1987-02-01), Wardenaar et al.
patent: 4675993 (1987-06-01), Harada
patent: 4980971 (1991-01-01), Bartschat et al.
patent: 5058263 (1991-10-01), Corbeij et al.
patent: 5079834 (1992-01-01), Itagaki et al.
patent: 5084959 (1992-02-01), Ande et al.
patent: 5084962 (1992-02-01), Takahashi et al.
patent: 5177864 (1993-01-01), Oyama
IBM Tech. Disclosure Bull vol. 26 No. 7B Dec. 1983, pp. 3664-3666 by V. DiLorenzo et al.
Gieles Antonius C. M.
Rosier Willem J.
Arbes Carl J.
Bartlett Ernestine C.
U.S. Philips Corp.
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