Method and device for peeling a film

Details Method and device for peeling a film Method and device for peeling a film

1994-10-21

1996-03-05

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156584, B32B 3100

Patent

active

054964326

ABSTRACT:
It is an object of the invention to provide film peeling method and device which, when a circuit board with laminated thin films coated on the front and back surfaces thereof is beaten by vibrator rods from the front and back sides thereof to thereby peel the film, can absorb variations in the coated positions of the front and back laminated thin films and also prevent the vibrator rods from being damaged when they beat each other idly.
Vibrators 16A, 16B are disposed on the front and back sides of a circuit board 14 with laminated thin films 12A, 12B coated on the front and back surfaces thereof, back and front back-up rollers 24B, 24A are disposed at positions respectively opposed to the front and back rods 18A, 18B of the vibrators 16A, 16B, and the back and front back-up rollers 24B, 24A are moved synchronously with the front and back rods 18A, 18B, respectively.

REFERENCES:
patent: 5277738 (1994-01-01), Moser et al.
patent: 5312505 (1994-05-01), Sumi et al.
patent: 5389192 (1995-02-01), Takimoto et al.

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