Method and device for passive alignment of diode lasers and opti

Metal working – Barrier layer or semiconductor device making – Barrier layer device making

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437906, 148DIG95, H01L 2102, H01L 2120, H01L 21302

Patent

active

050778781

ABSTRACT:
A method of passively aligning optical receiving elements such as fibers to the active elements of a light generating chip includes the steps of forming two front and one side pedestal structures on the surface of a substrate body, defining a vertical sidewall of the chip to form a mating channel having an edge at a predetermined distance from the first active element, mounting the chip epi-side down on the substrate surface, and positioning the fibers in fiber-receiving channels to that a center line of each fiber is aligned to a center line of a respective active element. When mounted, the front face of the chip is abutting the contact surfaces of the two front pedestals, and the defined sidewall of the mating channel is abutting the contact surface of the side pedestal. The passive alignment procedure is also effective in aligning a single fiber to a single active element.

REFERENCES:
patent: 4750799 (1988-06-01), Kawachi et al.
patent: 4930854 (1990-06-01), Albares et al.

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