Method and device for packaging and transporting electronic...

Details Method and device for packaging and transporting electronic... Method and device for packaging and transporting electronic...

2008-01-15

2008-01-15

Desai, Hemant M. (Department: 3721)

Package making

Methods

Filling preformed receptacle and closing

C053S442000, C053S473000, C053S173000, C053S557000

Reexamination Certificate

active

07318307

ABSTRACT:
The invention relates to an apparatus and a method for packaging and for transporting electronic devices. The devices include coverings made of a material that shrinks under the action of temperature that are pressed into receptacles of a belt-type carrier body. Electronic devices are inserted into the open front sides of said coverings. A belt top side and underside are in each case closed off with a covering sheet, after which the belt-type carrier body is heated.

REFERENCES:
patent: 4298120 (1981-11-01), Kaneko et al.
patent: 4753061 (1988-06-01), Braden et al.
patent: 5007534 (1991-04-01), Tamaki et al.
patent: 5203143 (1993-04-01), Gutentag
patent: 5325654 (1994-07-01), Juntunen et al.
patent: 5390472 (1995-02-01), Weiler et al.
patent: 5597074 (1997-01-01), Ko
patent: 5729963 (1998-03-01), Bird
patent: 5964352 (1999-10-01), Shoji
patent: 6082603 (2000-07-01), Takada et al.
patent: 6101790 (2000-08-01), Mori et al.
patent: 6149010 (2000-11-01), Tanaka et al.
patent: 6205745 (2001-03-01), Dudderar et al.
patent: 6216419 (2001-04-01), Sakurai
patent: 6264704 (2001-07-01), Minamitani et al.
patent: 6820401 (2004-11-01), Behnke
patent: 6823652 (2004-11-01), Troxtell, Jr.
patent: 7040171 (2006-05-01), McGee et al.
patent: 2003/0079446 (2003-05-01), Behnke
patent: 2003/0101692 (2003-06-01), Behnke
patent: 100 32 415 (2001-10-01), None
patent: 2001085360 (2001-03-01), None

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