Optical waveguides – Miscellaneous
Reexamination Certificate
2008-08-15
2011-10-25
Kim, Ellen (Department: 2874)
Optical waveguides
Miscellaneous
C359S247000, C359S291000
Reexamination Certificate
active
08045835
ABSTRACT:
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
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patent:
Chui Clarence
Cummings William J.
Gally Brian
Kothari Manish
Miles Mark
Kim Ellen
Knobbe Martens Olson & Bear LLP
QUALCOMM MEMS Technologies Inc.
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