Optical waveguides – Miscellaneous
Reexamination Certificate
2008-09-09
2008-09-09
Kim, Ellen (Department: 2874)
Optical waveguides
Miscellaneous
C359S247000
Reexamination Certificate
active
11045738
ABSTRACT:
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
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Chui Clarence
Cummings William J.
Gally Brian
Kothari Manish
Miles Mark
IDC LLC
Kim Ellen
Knobbe Martens Olson & Bear LLP
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