Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-06-11
2010-12-07
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Reexamination Certificate
active
07846749
ABSTRACT:
A method of monitoring a heat treatment of a microtechnological substrate includes placement of the substrate to be treated in a heating zone and applying a heat treatment to the substrate, under predetermined temperature conditions, while monitoring the change over the course of time in the vibratory state of the substrate, and detecting a fracture in the substrate by detecting a peak characteristic in the vibratory state over the course of time.
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Machine Translation of JP 2004-179566.
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Brinks Hofer Gilson & Lione
Commissariat a l''Energie Atomique
Geyer Scott B
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