Method and device for mechanically removing solder beads on the

Details Method and device for mechanically removing solder beads on the Method and device for mechanically removing solder beads on the

1997-07-25

1999-06-15

Ryan, Patrick

Metal fusion bonding

Process

With removing or reshaping of filler material or flash after...

228264, 228 201, 228 205, 228 19, 228199, 228200, 228201, B23K 3100

Patent

active

059113553

ABSTRACT:
The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanically removed without damaging the printed circuit boards, the solder beads (14) are mechanically removed by means of at least one jet (50) of cold gas directed onto the surface.

REFERENCES:
patent: 3680199 (1972-08-01), Johnson
patent: 4419566 (1983-12-01), Fortune
patent: 4995411 (1991-02-01), Lowell et al.
patent: 5205461 (1993-04-01), Bickford et al.
patent: 5419481 (1995-05-01), Lasto et al.
patent: 5579979 (1996-12-01), Kurpiela
Database WPI; Week 9738; Derwent Publications Ltd., London, GB; AN 97-408897; XP002045688 & HP 09 181 436 A (Mitsumoto T et al.) Jul. 11, 1997.
Patent Absracts of Japan; vol. 18, No. 202 (E-1535), Apr. 8, 1994 & JP 06 006025 A (Fujitsu Ltd), Jan. 14, 1994.
Patent Abstracts of Japan; vol. 18, No. 314 (M-1621), Jun. 15, 1994 & JP 06 071467 A (Fujitsu Ltd) Mar. 15, 1994.

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