Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-09-05
2006-09-05
Mayes, Melvin (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S306600, C156S308200, C156S311000, C156S322000, C156S324000, C156S327000
Reexamination Certificate
active
07101455
ABSTRACT:
The present invention provides a method for producing a laminate suitable for a flexible circuit board which is free from visual defects such as wrinkles and curls that appear when a plurality of laminating materials containing a thermally fusible laminating material are formed by thermally laminating these materials each other using a thermal-press forming device, which comprises the steps of: arranging a heat resistant protective material between a pressing surface and the laminating materials, laminating the materials by thermal pressure at not lower than 200° C., wherein the bonded laminating materials are in contact with the protective material, cooling the bonded laminating materials, and peeling off the protective material from the bonded laminating materials, whereby the laminate with less nonuniformity in pressurization, a uniform surface, and a good inter-layer adhesion, and the method and device for producing the laminate can be provided, more particularly, the thermal pressure and forming is performed by a thermal-press forming device having at least a pair of metal rolls.
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Furutani Hiroyuki
Fushiki Yasuo
Hase Naoki
Kataoka Kosuke
Brinks Hofer Gilson & Lione
Kaneka Corporation
Mayes Melvin
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