Method and device for forming a layer by plasma-chemical process

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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118723, 118 501, B05D 306, C23C 1400, C23C 1600

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active

049159780

ABSTRACT:
A method and a device are proposed for formation of a layer on a surface of a substrate by plasma-chemical process, where the surface is aligned parallel to the electrical field required for the plasma-chemical process. In addition, the gas required therefor flows directly onto the surface.

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