Electricity: measuring and testing – Magnetic – With means to create magnetic field to test material
Reexamination Certificate
2008-08-18
2010-10-26
Whittington, Kenneth J (Department: 2858)
Electricity: measuring and testing
Magnetic
With means to create magnetic field to test material
C324S239000, C451S008000
Reexamination Certificate
active
07821257
ABSTRACT:
A method and device for forecasting/detecting a polishing end point and for monitoring a real-time film thickness to suppress Joule heat loss due to the eddy current to the minimum, to precisely forecast/detect a polishing end point, to precisely calculate the remaining film thickness to be removed, and polishing rate. An inductor36in a sensor is arranged adjacent to a predetermined conductive film28, and a magnetic flux change induced in the conductive film28by a magnetic flux formed by the inductor36is monitored, and by use of a magnetic flux change when a film thickness becomes corresponding to skin depth in which a film thickness in polishing is determined by the material of the predetermined conductive film28as a factor, a magnetic flux change part to forecast a polishing end point in the magnetic flux change process is detected, and a polishing end point is forecasted from the magnetic flux change part, and a polishing rate and a remaining film thickness amount to be removed are calculated on the spot.
REFERENCES:
patent: 5559428 (1996-09-01), Li et al.
patent: 7046001 (2006-05-01), Tada et al.
patent: 2002/0047705 (2002-04-01), Tada et al.
patent: 2006/0214657 (2006-09-01), Tada et al.
patent: 2007/0103150 (2007-05-01), Tada et al.
patent: 2008/0290865 (2008-11-01), Fujita et al.
patent: 2009/0058409 (2009-03-01), Fujita
patent: 2009/0256558 (2009-10-01), Fujita et al.
Fujita Takashi
Kitade Keita
Yokoyama Toshiyuki
Fattibene Paul A.
Fattibene and Fattibene
Tokyo Seimitsu Co., Ltd
Whittington Kenneth J
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