Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2004-04-30
2008-08-12
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S114000, C438S460000, C438S463000
Reexamination Certificate
active
07410831
ABSTRACT:
In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.
REFERENCES:
patent: 6245593 (2001-06-01), Yoshihara et al.
patent: 6297076 (2001-10-01), Amagai et al.
patent: 2004/0180473 (2004-09-01), Kawai
patent: 6188310 (1994-07-01), None
patent: 2002110588 (2002-04-01), None
patent: 2002192367 (2002-07-01), None
patent: 2002192368 (2002-07-01), None
patent: 2002192369 (2002-07-01), None
patent: 2002192370 (2002-07-01), None
patent: 2002192371 (2002-07-01), None
patent: 2002205180 (2002-07-01), None
patent: 2002110588 (2002-12-01), None
Azuma Masayuki
Sakaya Yasuyuki
Safran David S.
Thai Luan
Tokyo Seimitsu Co. Ltd.
LandOfFree
Method and device for dividing plate-like member does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and device for dividing plate-like member, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and device for dividing plate-like member will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4019971