Method and device for cutting wire formed on semiconductor...

Details Method and device for cutting wire formed on semiconductor... Method and device for cutting wire formed on semiconductor...

2006-05-02

2006-05-02

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Repair or restoration

C438S462000, C438S712000, C438S961000

Reexamination Certificate

active

07037732

ABSTRACT:
Method and device for cutting a wire with a small number of processing operations. The method includes forming a cut portion by scanning the semiconductor substrate with a focused ion beam to cut the wire. The method further includes forming a clear region continuously from the cut portion by scanning the semiconductor substrate with the focused ion beam. The clear region is free of stray material of the wire.

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“Achieving Quick Design Debugging With Circuit Correction Function Using Focused Ion Beam Technique”; IBM, Jun. 23, 1999, http://www-6.ibm.com/jp/chips/v5—1/mn51011.html.

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