Method and device for cleaning and then bonding substrates

Details Method and device for cleaning and then bonding substrates Method and device for cleaning and then bonding substrates

2007-01-30

2007-01-30

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

Reexamination Certificate

active

10311568

ABSTRACT:
The invention relates to a method and to a device for cleaning and then bonding substrates. According to the invention, at least two opposite substrates are obliquely or vertically sprayed with a cleansing liquid by means of at least one nozzle and are preferably dried, aligned and directly bonded under micro-clean room conditions. The bonding process is preferably visually monitored during bonding in order to immediately remove insufficiently bonded substrates from the process. The inventive device is compact and allows integration of the process steps in a single installation without disruption. The invention is further characterized by an improved quality of the bonded layers and an improved productivity of the bonding process. It also allows the use of novel bonding processes.

REFERENCES:
patent: 4883215 (1989-11-01), Goesele et al.
patent: 5129827 (1992-07-01), Hoshi et al.
patent: 5131968 (1992-07-01), Wells et al.
patent: 5308400 (1994-05-01), Chen
patent: 5395788 (1995-03-01), Abe et al.
patent: 5449405 (1995-09-01), Cardinali et al.
patent: 5706843 (1998-01-01), Matsuo
patent: 5804494 (1998-09-01), Mitani et al.
patent: 5868865 (1999-02-01), Akimoto
patent: 6008113 (1999-12-01), Ismail et al.
patent: 6018884 (2000-02-01), Fukunaga et al.
patent: 6051481 (2000-04-01), Kuiken et al.
patent: 6375741 (2002-04-01), Reardon et al.
patent: 6491764 (2002-12-01), Mertens et al.
patent: 6632289 (2003-10-01), Masui et al.
patent: 6770151 (2004-08-01), Ravkin et al.
patent: 6863796 (2005-03-01), Chueh et al.
patent: 0999577 (2000-05-01), None
patent: 57195593 (1982-12-01), None
Patent Abstracts of Japan Publication No. 60072234 A, no date avail : no author avail.
Patent Abstracts of Japan Publication No. 09017768, no date avail : no author avail.
Patent Abstracts of Japan Publication No. 09213666 A, no date avil: no author avail.

Affiliated with

Also associated with

Rating

Method and device for cleaning and then bonding substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and device for cleaning and then bonding substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and device for cleaning and then bonding substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3760294