Material or article handling – Article reorienting device – Orienter has article gripping means
Reexamination Certificate
2006-09-19
2006-09-19
Lillis, Eileen D. (Department: 3652)
Material or article handling
Article reorienting device
Orienter has article gripping means
C414S416010, C414S757000, C414S936000, C414S744500, C414S433000
Reexamination Certificate
active
07108476
ABSTRACT:
A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.
REFERENCES:
patent: 384939 (1888-06-01), Stollwerck
patent: 440984 (1890-11-01), Williams
patent: 3160295 (1964-12-01), Roark
patent: 3165186 (1965-01-01), Zeiter
patent: 3297134 (1967-01-01), Pastuszak
patent: 3480158 (1969-11-01), Pandjiris et al.
patent: 3499560 (1970-03-01), Le Gros
patent: 3712483 (1973-01-01), Messervey
patent: 3820647 (1974-06-01), Waugh, Jr. et al.
patent: 3972424 (1976-08-01), Levy et al.
patent: 3982627 (1976-09-01), Isohata
patent: 4094426 (1978-06-01), Vogel
patent: 4213318 (1980-07-01), Priebe
patent: 4244673 (1981-01-01), Henderson
patent: 4407627 (1983-10-01), Sato et al.
patent: 4423998 (1984-01-01), Inaba et al.
patent: 4427332 (1984-01-01), Manriquez
patent: 4449885 (1984-05-01), Hertel et al.
patent: 4483434 (1984-11-01), Miwa et al.
patent: 4621967 (1986-11-01), Masada
patent: 4655584 (1987-04-01), Tanaka et al.
patent: 4662811 (1987-05-01), Hayden
patent: 4685206 (1987-08-01), Kobayashi et al.
patent: 4687542 (1987-08-01), Davis et al.
patent: 4691817 (1987-09-01), Haar
patent: 4720130 (1988-01-01), Andou
patent: 4766322 (1988-08-01), Hashimoto
patent: 4775281 (1988-10-01), Prentakis
patent: 4787814 (1988-11-01), Vaerman
patent: 4813840 (1989-03-01), Prabhakar et al.
patent: 4875824 (1989-10-01), Moe et al.
patent: 4887904 (1989-12-01), Nakazato et al.
patent: 4892455 (1990-01-01), Hine
patent: 4944650 (1990-07-01), Matsumoto
patent: 5022695 (1991-06-01), Ayers
patent: 5102291 (1992-04-01), Hine
patent: 5133635 (1992-07-01), Malin et al.
patent: 5265170 (1993-11-01), Hine et al.
patent: 5364222 (1994-11-01), Akimoto et al.
patent: 5445486 (1995-08-01), Kitayama et al.
patent: 5511934 (1996-04-01), Bacchi et al.
patent: 5513948 (1996-05-01), Bacchi et al.
patent: 5538385 (1996-07-01), Bacchi et al.
patent: 5697759 (1997-12-01), Bacchi et al.
patent: 5741113 (1998-04-01), Bacchi et al.
patent: 5831738 (1998-11-01), Hine
patent: 5870488 (1999-02-01), Rush et al.
patent: 5917169 (1999-06-01), Poli et al.
patent: 5944476 (1999-08-01), Bacchi et al.
patent: 5970818 (1999-10-01), Kikuchi et al.
patent: 5980194 (1999-11-01), Freerks et al.
patent: 6098484 (2000-08-01), Bacchi et al.
patent: 6105454 (2000-08-01), Bacchi et al.
patent: 6116848 (2000-09-01), Thomas et al.
patent: 6188323 (2001-02-01), Rosenquist et al.
patent: 6256555 (2001-07-01), Bacchi et al.
patent: 6275748 (2001-08-01), Bacchi et al.
patent: 6298280 (2001-10-01), Bonora et al.
patent: 6438460 (2002-08-01), Bacchi et al.
patent: 6453214 (2002-09-01), Bacchi et al.
patent: 6618645 (2003-09-01), Bacchi et al.
patent: 6652216 (2003-11-01), Astegno et al.
patent: 30 04 462 (1981-08-01), None
patent: 235 156 (1986-04-01), None
patent: 236 714 (1986-06-01), None
patent: 376 160 (1989-12-01), None
patent: 0 445 651 (1992-07-01), None
patent: 0 620 584 (1994-04-01), None
patent: 1 078 391 (1999-05-01), None
patent: 2 567 160 (1986-01-01), None
patent: 2 751 769 (1996-07-01), None
patent: 1 457 162 (1974-07-01), None
patent: 2 171 978 (1985-03-01), None
patent: 56-043718 (1981-04-01), None
patent: 56-024921 (1981-10-01), None
patent: 58-090735 (1983-05-01), None
patent: 58-144022 (1983-08-01), None
patent: 58-182846 (1983-10-01), None
patent: 59-104138 (1984-06-01), None
patent: 59-228720 (1984-12-01), None
patent: 61-267611 (1986-11-01), None
patent: 61-291335 (1986-12-01), None
patent: 62-004142 (1987-01-01), None
patent: 62-188642 (1987-08-01), None
patent: 02-122541 (1990-10-01), None
patent: 03-052248 (1991-06-01), None
patent: 03-296244 (1991-12-01), None
patent: 06-345261 (1994-12-01), None
patent: 85564 (1957-07-01), None
patent: 879681 (1981-07-01), None
patent: WO 80/00073 (1980-01-01), None
patent: WO 83/04240 (1983-12-01), None
patent: WO 84/04739 (1984-12-01), None
patent: WO 97/45861 (1997-12-01), None
patent: WO 99/57752 (1999-11-01), None
Berstelsen et al. “Semiconductor Transportation Sensing Alignment Technique,” IBM Technical Disclosure Bulletin 20:533-534 (1977).
Recif SPP12 product.
Declaration of Laurent Moesle for Response to Office Action.
Declaration and SPP 12 product documents, filed in connection with Recif's U.S. Appl. No. 09/674,613, now U.S. Patent No. 6,652,216, Exhibit A of the Declaration of Laurent Moesie for Response to Office Action, 19 pages total.
Proforma Invoice NBRL2494-06-98 and two pages of air bill documents relating to the importation of one unit of the SPP300A product into the United States in Jun. 1998, Exhibit B of the Declaration of Laurent Moesle for Response to Office Action, 3 pages total.
Facsimile correspondence from Hannah Levy dated Jul. 24, 1998, Exhibit C of the Declaration of Laurent Moesle for Response to Office Action, 1 page total.
Astegno Pierre
Esteve Ekaterina
Gaudon Alain
Adams Gregory
Lillis Eileen D.
Recif Technologies SAS
LandOfFree
Method and device for changing a semiconductor wafer position does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and device for changing a semiconductor wafer position, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and device for changing a semiconductor wafer position will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3593760