Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific voltage responsive fault sensor
Reexamination Certificate
2005-08-23
2005-08-23
Sircus, Brian (Department: 2836)
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific voltage responsive fault sensor
C361S119000
Reexamination Certificate
active
06934138
ABSTRACT:
A method and/or device that may be used in locations where equipotential bonding is not practiced can be installed on a customer premises equipment device basis that provides over-voltage protection between the AC main and HFC ground planes. According to one aspect of the present invention, a bonding link is established between the AC main and the HFC coaxial braid that allows energy surges to bypass the CPE equipment and to be passed on to the AC mains, which are traditionally more equipped to deal with these large energy surges. According to another aspect of the present invention, an apparatus is disclosed that may be incorporated into any premises powered HFC CPE device for protection. The apparatus provides a surge energy bypass path around the CPE device being protected and allow voltage differentials to be normalized between systems.
REFERENCES:
patent: 4807083 (1989-02-01), Austin
patent: 4876713 (1989-10-01), Crosby et al.
patent: 4903161 (1990-02-01), Huber et al.
patent: 5675468 (1997-10-01), Chang
patent: 5835326 (1998-11-01), Callaway
patent: 6249415 (2001-06-01), Daoud et al.
patent: 6252754 (2001-06-01), Chaudhry
patent: 6282075 (2001-08-01), Chaudhry
Cullen Lawrence T.
General Instrument Corporation
Nguen Danny
Sircus Brian
LandOfFree
Method and device for bonding AC utilities and HFC access... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and device for bonding AC utilities and HFC access..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and device for bonding AC utilities and HFC access... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3508593