Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1983-08-24
1984-10-09
Kittle, John E.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
4273746, 4273768, 228221, 228231, 164 61, B23K 3102, B05D 100
Patent
active
044761511
ABSTRACT:
A target body composed of a select target material is attached to a cooling plate for sputtering systems in such a manner that substantially no bubbles, pores or oxide layers are present in the ultimate solder joint between the surfaces joined together. A pre-soldered target body and a corresponding presoldered cooling plate are exposed, in a vacuum, to a temperature above the melting point of the solder utilized so that degasification of the liquified solder occurs and any oxide layers present are decomposed and purged from the solder. Upon cooling in vacuum, the solder resolidifies and excludes any air bubbles, pores or oxide layers. A frame body with a two-step recess, with a lower recess or opening snugly fitting about a cooling plate and an upper opening freely fitting about the solder joint can be used to practice this technique. A subsequent reflow soldering can likewise occur in vacuum at a temperature above the melting point of the solder utilized.
REFERENCES:
patent: 2092557 (1937-09-01), Quamstrom
patent: 4341816 (1982-07-01), Lauterbach et al.
Keller Hartmut
Roy Aroon S.
Kittle John E.
Seidleck James J.
Siemens Aktiengesellschaft
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