Method and device for applying material to a workpiece

Details Method and device for applying material to a workpiece Method and device for applying material to a workpiece

2006-10-17

2006-10-17

Talbot, Brian K. (Department: 1762)

Metal fusion bonding

Process

With condition responsive, program, or timing control

C228S008000, C228S041000, C228S245000, C228S246000, C427S008000, C427S098400, C427S180000, C427S256000

Reexamination Certificate

active

07121449

ABSTRACT:
In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compressed gas. As soon as the tip (12) of the capillary approaches the workpiece (1), the dynamic pressure increases and is used as a measure for the distance between the tip (12) of the capillary (3) and the workpiece (1), enabling the feed motion of the capillary to be controlled.

REFERENCES:
patent: 4661368 (1987-04-01), Rohde et al.
patent: 5148963 (1992-09-01), Hicks
patent: 6093251 (2000-07-01), Carr et al.
patent: 6152348 (2000-11-01), Finn et al.
patent: 6336581 (2002-01-01), Tuchiya et al.
patent: 6634545 (2003-10-01), Razon et al.
patent: 195 41 996 (1997-05-01), None
patent: WO 97/17191 (1997-05-01), None

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