Method and device for activating chemical compositions

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

118612, 156 736, 156155, 156578, 427 57, B05D 100, B05D 312

Patent

active

048678171

ABSTRACT:
Chemical compositions such as adhesive, sealing or coating compositions containing one or more microencapsulated ingredients are activated by directly contacting an ultrasonic device (2) to the composition (8) and sonicating the composition to rupture the microcapsules. The method may be carried out in a sonication chamber (1) in which the ultrasonic device (2) is immersed in the composition (8) and from which the composition flows before it sets. Alternatively the ultrasonic energy may be applied to the composition in situ.

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patent: 4627990 (1986-12-01), Saga et al.
patent: 4649060 (1987-03-01), Ishikawa et al.

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