Method and device discharging surface treatment

Details Method and device discharging surface treatment Method and device discharging surface treatment

2005-08-16

2005-08-16

Padgett, Marianne (Department: 1762)

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

C427S580000, C204S192380, C204S292000, C219S069150, C219S069170

Reexamination Certificate

active

06929829

ABSTRACT:
Powder of a simple substance or a combination of a plurality of carbides of metals belonging to the IVa, Va and Via families in the Periodic Table is mixed with a ferrous-family metal powder or non-ferrous metal powder having the same composition as the treatment target (2) as a simple substance or a combination of a plurality of metals, and this is compressed and molded, and incompletely sintered to form an electrode (12) serving as a discharge processing electrode; and said device is provided with a switching unit which alters electrical conditions at the time when the base member of the treatment target (2) is directly subjected to a discharging surface treatment and the electrical conditions at the time when a coating film (13) that has been formed is subjected to a discharging surface treatment according to the characteristics of the treatment target material. Thus, a discharge is continuously generated between the sintered electrode (12) and the treatment target (2) so that the coating film (13) is continuously allowed to deposit on the surface of the treatment target (2) by the discharging energy to form a thick film.

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Translation of Japanese app. No. 8-300227A to Saito et al (PTO version).

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