Method and control system for applying solder flux to a printed

Coating apparatus – Control means responsive to a randomly occurring sensed... – Responsive to attribute – absence or presence of work

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118679, 118712, 118324, B05B 1502

Patent

active

059388480

ABSTRACT:
A first embodiment includes a control system which operates a spray gun to apply an even coating of flux to a circuit board or a plurality of different length circuit boards irrespective of the speed that the circuit board(s) move through a coating chamber. In a second embodiment, the control system pulses the spray gun on and off with a pulsing pattern that coats a plurality of zones of a circuit board with spray patterns of different length and thickness.

REFERENCES:
patent: 4164001 (1979-08-01), Patnaude
patent: 4419384 (1983-12-01), Kane et al.
patent: 5217745 (1993-06-01), Patel
patent: 5368219 (1994-11-01), Hogan et al.
patent: 5415337 (1995-05-01), Hogan et al.
patent: 5534067 (1996-07-01), Fulker et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and control system for applying solder flux to a printed does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and control system for applying solder flux to a printed , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and control system for applying solder flux to a printed will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-311740

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.