Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
1999-06-09
2001-02-20
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S108000, C438S612000
Reexamination Certificate
active
06190942
ABSTRACT:
FIELD OF THE INVENTION
The invention concerns a process for producing a chip card, wherein a semiconductor chip on a module is fitted in an opening in a card carrier with the attainment of a suitable electrical and mechanical connection, and a connecting arrangement for producing a chip card of that kind.
BACKGROUND OF THE INVENTION
In a known process for producing a chip card, in particular a card in which there are both means for contact-less data transmission and also a galvanic contact plane, a module which includes a semiconductor chip is fitted into a card body.
The module is preferably inserted into an opening in the card body and laminated to the card body by means of joining or the like, thereby obtaining a suitable mechanical and electrical connection.
An electrically conducting connection between the module and the card body or contacts disposed on the card body, which are in contact with a coil for making a contact-less communication with the surroundings, is afforded for example by virtue of the fact that an anisotropic conducting adhesive is applied in the region of the terminal locations and/or the connecting locations of the respective means for contact-less data transmission and the adhesive is compressed or compacted at least in the region of the terminal locations to such an extent that an electrically conducting bridge is produced.
In the case of an adhesive with conducting particles, the result of this is that the particles are in contact with each other in the region between the terminal locations and the means for contact-less data transmission, thereby resulting in the conducting connection.
The modules which are used in the production of chip cards generally have recourse to a plastic material carrier on which is arranged the semiconductor chip referred to above, possibly provided with ISO-contact surfaces. The module which is prefabricated in that way is connected to the card carrier which for example can comprise polycarbonate. That connecting operation or the step of inserting the module into the card body in a for example milled opening is usually effected by employing a glueing process, using a hot or melt adhesive.
In the situation where the aim is to produce combination cards which are suitable both for contact-less and for contact-mode use, or contact-less cards, a further contact plane with terminal locations for the induction loop must be provided. Those terminal locations are preferably disposed in a raised relationship on the surface of the module and/or on the surface or at the side faces of the opening in the card carrier. In the case of arrangements of that kind, it is then possible to effect the operation of glueing the modules and the card carriers by means of the procedure for making the electrically conducting connection, in one working operation. It has been found however that the required temperature and time conditions for producing both electrical and mechanical connections which are reliable involves close tolerances so that, in the case of process parameters which are not at their optimum, the long-term stability of cards which are produced in that way is reduced and, by virtue of the dimensions and the plastic properties of the module and of the card carrier, warping phenomena and stresses occur in the card, with the consequence of resulting in disturbed electrical connections, that is to say a lower level of reliability.
The same applies in regard to force-locking connections, for example by means of a spring element. Admittedly in this case warping or stresses can be accommodated by contact spring elements, but problems arise in regard to surface corrosion of the contacts.
OBJECTS OF THE INVENTION
The object of the present invention is to provide a process for producing a chip card and a connecting arrangement for a production process of that kind, with which a semiconductor chip disposed on a module can be both electrically and also mechanically contacted with a high level of reliability into an opening in a card body, wherein the resulting overall arrangement is to ensure a high degree of long-term stability and reliability of the chip card.
The object of the invention is attained by a process as set forth in claim
1
, claim
4
or claim
5
and a connecting arrangement as set forth by the features of claims
7
,
9
or
10
, while the appendant claims embrace at least desirable configurations or developments.
SUMMARY OF THE INVENTION
The basic concept of the invention, in terms of the which process, provides that the module to be implanted into the opening in the card electrically interacts not directly but indirectly with the card carrier or an induction coil present in the card carrier for making a contact-less connection with the surroundings.
In a first embodiment of the invention the module to be implanted in the opening in the card has a first coil, wherein that first coil is inductively connected to a second coil disposed in or at the opening in the card carrier. The second coil is then in contact in per se known manner with a third (antenna) coil in the chip card, for making a contact-less connection with the surroundings. The second and third coils can also form a common coil.
In accordance with a second embodiment of the process according to the invention the module to be implanted in the opening in the card is provided with at least one first capacitive coupling surface, wherein first capacitive coupling surface electrically interacts with a second capacitive coupling surface in the opening in the card carrier. The second capacitive coupling surface results in a per se known induction coil for making a contact-less connection with the surroundings.
A third embodiment of the process according to the invention now involves both a capacitive coupling between the module to be implanted and the card carrier and also an inductive coupling, thus affording optimum data and signal transmission between module or semiconductor chip and the card carrier.
In a preferred development of the invention the module carrying the chip is provided with a special metallization plane which is in the form of an induction coil. In the operation of assembling the module in the opening in the contact surface that induction coil is brought into relationship with a coil disposed in the opening, for inductive coupling. The coil disposed in the opening in the card carrier can be a component of the per se known induction coil for electrical contacting to the exterior.
In accordance with the invention, to enhance the degree of coupling between the inductive elements, that is to say the first and second coils, it is proposed that the module at least partially and/or the card carrier, in the region of the second coil, is provided with highly permeable doping substances, or that a highly permeable coating is applied. Preferably, finely granulated rare earth magnets which are set to a suitable grain size can be used for that purpose. Per se known titanates and ferrite materials are also suitable for enhancing permeability.
It is in accordance with the invention that the first and second coils can be embodied both in the form of a wire coil or in a printed or additively applied form. It is also possible to envisage etching out coil turns or burning them out of a metallisation layer by using a laser.
The first coil in the module or the first capacitive coupling surface can be applied to the side which is directed inwardly relative to the card carrier or can also be disposed on an intermediate carrier which, with a suitable insulating intermediate layer, serves to receive ISO-external contacts.
In terms of the connecting arrangement, for the production of a chip card comprising a module with a semiconductor chip and a card carrier with an opening for receiving the module on or in the insertion side of the module a first coil is formed which is electrically connected to connections or terminals of the semiconductor chip. Disposed in or on the opening in the card carrier is a second coil wherein after insertion of the module into the opening in the ca
Houdeau Detlef
Reiner Robert
Rettig Rainer
Wilm Robert
Dang Phuc Trong
Nelms David
PAV Card GmbH
St. Onge Steward Johnston & Reens LLC
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