Method and configuration for conditioning a polishing pad...

Details Method and configuration for conditioning a polishing pad... Method and configuration for conditioning a polishing pad...

2006-08-29

2006-08-29

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S056000, C451S443000

Reexamination Certificate

active

07097535

ABSTRACT:
A method and a configuration for conditioning a polishing pad surface are described. The method includes measuring a rotation table current or voltage as an input for a motor driving the rotation of the polishing pad versus a rotating conditioning head. The electrical power input is used as a measure of an actual abrasion effective in regenerating the polishing pad. Since the polishing pad commonly deteriorates by repeated usage, i.e. debris settles down onto its surface, the abrasion efficiency decreases. The method issues a warning signal, in response to the electrical power input exceeding a limit, to take actions for maintaining the uniformity of the conditioning process. The polishing pad rotation can be accelerated or the conditioning head pressure force or rotation can be increased in response to the warning signal. Therefore, the polishing pad can be conditioned.

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