Method and composition for making mechanical and electrical cont

Details Method and composition for making mechanical and electrical cont Method and composition for making mechanical and electrical cont

1991-12-06

1994-02-15

Lieberman, Paul

Compositions

Electrically conductive or emissive compositions

Metal compound containing

252512, 252514, 252521, 528350, 106 122, 420507, 420557, H01B 100, H01B 120, H01B 122

Patent

active

052864170

ABSTRACT:
A fusible conductive adhesive for making electrical and mechanical contact is provided. The fusible conductive adhesive contains a polymer having a glass transition temperature and a thermal expansion co-efficient. The thermal expansion co-efficient of the polymer is in the range of about 5 parts per million per degree centigrade to about 10 parts per million per degree centigrade along a z-axis. The polymer is loaded with a conductive material having a sintering temperature range overlapping the glass transition temperature of the polymer. In addition, the loading of the conductive material in the polymer is in the range of about 15% to about 20% conductive material by weight based on the total weight of the polymer and the conductive material.

REFERENCES:
patent: 4557857 (1985-12-01), Sorensen
patent: 4568592 (1986-02-01), Kawaguchi et al.
patent: 4612361 (1986-09-01), Peters
patent: 4701279 (1987-10-01), Kawaguchi et al.
patent: 4882227 (1989-11-01), Iwase et al.
patent: 4886874 (1989-12-01), Nagano et al.
patent: 4978737 (1990-12-01), Vora

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