Method and composition for electroless nickel deposition

Details Method and composition for electroless nickel deposition Method and composition for electroless nickel deposition

1985-05-03

1986-07-15

Hayes, Lorenzo B.

Coating processes

Immersion or partial immersion

Metal base

106 122, 106 126, 4274431, 428936, C23C 302

Patent

active

046006095

ABSTRACT:
An electroless nickel plating method and composition is disclosed wherein a soluble acetylenic compound is included within the plating bath in small amounts effective to improve the specularity of the nickel deposit without substantially decreasing the electroless plating rate of the bath. The method and compositions of the invention are useful in producing mirror-bright electroless nickel coatings free of haze.

REFERENCES:
patent: 2658841 (1953-11-01), Gutzeit et al.
patent: 2658842 (1953-11-01), Gutzeit et al.
patent: 3457089 (1969-07-01), Shipley et al.
patent: 3661597 (1972-05-01), Gucca
patent: 4049509 (1977-09-01), Such et al.
patent: 4265943 (1981-05-01), Goldstein et al.
patent: 4371397 (1983-02-01), Homna et al.
Plokhov et al., Effect of Leveling Additives in Electroless Nickel Plating.

Affiliated with

Also associated with

Rating

Method and composition for electroless nickel deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and composition for electroless nickel deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and composition for electroless nickel deposition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1740579