Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-05-31
2005-05-31
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S833000, C029S852000
Reexamination Certificate
active
06898846
ABSTRACT:
A method for manufacturing a modular electrical circuit includes the steps of pre-manufacturing a plurality of components having fine features such as resistors, capacitors, inductances, and conductors formed on a dielectric substrate. The pre-manufactured components are laminated each to the other in a predetermined order. Each pre-manufactured component includes one or more electrical elements of the same type coupled each to the other by conducting lines. Each dielectric substrate includes through vias filled with the conductive material which serve for cross-coupling of the elements of neighboring components. Position of the passive elements, as well as conductive lines and through vias, are pre-designed to allow precise coordination between the elements of different components in the multi-layered modular electrical circuit.
REFERENCES:
patent: 4758922 (1988-07-01), Ishigaki et al.
patent: 5708569 (1998-01-01), Howard et al.
patent: 5834994 (1998-11-01), Shapiro
patent: 6218729 (2001-04-01), Zavrel et al.
patent: 6456172 (2002-09-01), Ishizaki et al.
patent: 6577208 (2003-06-01), Kushitani et al.
patent: 6750737 (2004-06-01), Uriu et al.
M.F. Davis et al., “RF-Microwave Multi-Band Design Solutions for Multilayer Organic System on Package Integrated Passives,” 2002 IEEE MTT-S Digest, pp. 2217-2220.
Sidharth Dalmia et al., “Design and Optimization of High-Q RF Passives on SOP-Based Organic Substrates,” 2002 Electronic Components and Technology Conference, pp. 495-503.
Duignan Michael T.
Liu David
Zhang Chengping
Arbes Carl J.
Potomac Photonics, Inc.
Rosenberg , Klein & Lee
LandOfFree
Method and components for manufacturing multi-layer modular... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and components for manufacturing multi-layer modular..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and components for manufacturing multi-layer modular... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3429846