Method and components for implementing EMC shielded...

Details Method and components for implementing EMC shielded... Method and components for implementing EMC shielded...

2007-12-18

2007-12-18

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S816000, C361S800000, C361S753000, C361S799000, C333S012000, C174S032000, C174S350000

Reexamination Certificate

active

10865251

ABSTRACT:
A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.

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Chen et al, “Optimum Placement of Decoupling Capacitors on Packages and Printed Circuit Boards Under the Guidance of Electromagnetic Field Simulation”, 46thElectronic Components & Technology Conference, Conference Proceedings, pp. 756-760, May 1996.

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