Method and cleaner composition for stripping copper containing r

Details Method and cleaner composition for stripping copper containing r Method and cleaner composition for stripping copper containing r

1999-12-20

2000-09-26

Del Cotto, Gregory R.

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

510175, 510176, 510178, 510254, 510257, 510264, 216 88, 216 89, 216105, 216106, 216107, 438692, 438693, 438754, 438756, B08B 308

Patent

active

06123088&

ABSTRACT:
A cleaner composition for removing from within a microelectronic fabrication a copper containing residue layer in the presence of a copper containing conductor layer, and a method for stripping from within a microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer. The cleaner composition comprises: (1) a hydroxyl amine material; (2) an ammonium fluoride material; and (3) a benzotriazole (BTA) material. The cleaner composition contemplates the method for stripping from within the microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer.

REFERENCES:
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patent: 5770095 (1998-06-01), Sasaki et al.
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patent: 5882425 (1999-03-01), Graham
patent: 5897379 (1999-04-01), Ulrich et al.
patent: 6068000 (2000-05-01), Tanabe et al.
Ng et al., "Synthesis of Some Carbonyl Derivatives of BTA and Determination of Their Inhibitive Properties for Copper in 3% NaCl Solution," Corrosion Science and Protection Technology, vol. 9 (3), Jul. 1997, pp. 201-204.

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