Method and clamping device for bonding thin lens wafers

Details Method and clamping device for bonding thin lens wafers Method and clamping device for bonding thin lens wafers

1989-02-27

1990-05-22

Woodard, Joye L.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 99, 156295, 156581, 1565833, B29C 6548, B32B 100

Patent

active

049274805

ABSTRACT:
A clamping device for bonding lens wafers, the device having a resilient stamp and an oppositely-disposed resilient mold. The stamp surface is slightly more curved than the concave surface of the top wafer and the mold surface is slightly more planar than the convex surface of the bottom wafer. As the wafers are squeezed between the stamp and mold, the stamp and mold deform and bonding material is squeezed evenly outwardly between the wafers.

REFERENCES:
patent: 4564408 (1986-01-01), Crumbach et al.

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