Method and circuits for localizing defective interconnect...

Details Method and circuits for localizing defective interconnect... Method and circuits for localizing defective interconnect...

2006-12-05

2006-12-05

Hirshfeld, Andrew H. (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

For fault location

C324S527000, C324S538000

Reexamination Certificate

active

07145344

ABSTRACT:
Described are methods and circuits for identifying defective device layers and localizing defects. Production PLD tests extract statistically significant data relating failed interconnect resources to the associated conductive metal layer. Failure data thus collected is then analyzed periodically to identify layer-specific problems. Test circuits in accordance with some embodiments employ interconnect resources heavily weighted in favor of specific conductive layers to provide improved layer-specific failure data. Some such test circuits are designed to identify open defects, while others are designed to identify short defects.

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