Method and circuit testing apparatus for equalizing a contact fo

Details Method and circuit testing apparatus for equalizing a contact fo Method and circuit testing apparatus for equalizing a contact fo

1996-06-07

1997-07-01

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

439 66, 324 725, G01R 106, G01R 3102

Patent

active

056442491

ABSTRACT:
This invention presents a method and a mechanism for contacting a set of vertical probes of a circuit testing mechanism with a set of pads or bumps of a circuit under test. The vertical probes have a circular cross section, a tip portion of length L1 and a beam portion of length L2, such that the beam portion extends at a right angle to the tip portion. The tip portion is guided through a guide hole to the pads of the circuit under test and the beam portion secured by its end. In this geometry the contact force between the probe and the pad is described by the relation: ##EQU1## where D.sub.v is a vertical deflection of the probe, I is an area moment of inertia of the probe about its axis, and E is a Young's modulus of the probe. The tip length L1 and beam length L2 are selected for each of the vertical probes in such a way the contact force F in this relation is kept constant thus ensuring that the contact force F between the vertical probes and pads remains substantially equal.

REFERENCES:
patent: 3613001 (1971-10-01), Hostetter
patent: 4322682 (1982-03-01), Schadwill
patent: 4523144 (1985-06-01), Okubo et al.
patent: 4567433 (1986-01-01), Ohkubo et al.
patent: 4721908 (1988-01-01), Driller et al.
patent: 5151651 (1992-09-01), Shibata
patent: 5493230 (1996-02-01), Swart et al.
patent: 5500606 (1996-03-01), Holmes

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