Method and article of manufacture for wire bonding with...

Details Method and article of manufacture for wire bonding with... Method and article of manufacture for wire bonding with...

2010-01-22

2011-12-27

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S784000, C257S786000, C257S659000, C257S678000

Reexamination Certificate

active

08084857

ABSTRACT:
A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the integrated circuit and terminating the wire at a second bond site. The bonding and terminating steps are repeated for at least two differential wire bond pairs, and proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.

REFERENCES:
patent: 5801450 (1998-09-01), Barrow
patent: 6005293 (1999-12-01), Mori
patent: 6538336 (2003-03-01), Secker et al.
patent: 6812580 (2004-11-01), Wenzel et al.
patent: 7002249 (2006-02-01), Duffy et al.
patent: 09-064087 (1997-03-01), None
patent: 2000-340711 (2000-12-01), None
patent: 2001-298039 (2001-10-01), None
M. Grupen Shemansky, et al., “When the Package Means as Much as the Chip,” EDN, pp. 51-56, Jul. 2003.

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