Method and arrangement for subdividing semiconductor bars into s

Details Method and arrangement for subdividing semiconductor bars into s Method and arrangement for subdividing semiconductor bars into s

1992-11-06

1994-02-15

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51 5D, 51325, 51283R, 125 1302, 125 1119, B24B 700, B24B 5302, B28B 502, B28B 102

Patent

active

052855970

ABSTRACT:
A device for subdividing semiconductor bars into wafers comprises a grinding tool having two concentrically arranged grinding discs. A rough grinding disc is arranged inside of an outer smooth polishing grinding disc. The grinding tool grinds a lower face of a semiconductor bar to a smooth planar form. A first electrolytic truer operates in conjunction with the outer smooth polishing grinding disc while a second electrolytic truer operates in conjunction with the inner rough grinding disc. The truers are arranged to define an axial offset between the grinding surfaces of the grinding discs so that a lower face of the bar is smoothed. The device also has a slicing tool for slicing the bar into wafers which will have a smooth planar form.

REFERENCES:
patent: 4663890 (1987-05-01), Brandt
patent: 4881518 (1989-11-01), Feldmeier
patent: 4894956 (1990-01-01), Honda et al.
patent: 4896459 (1990-01-01), Brandt
patent: 4947598 (1990-08-01), Sekiya
patent: 4967461 (1990-11-01), Feldmeier
patent: 4967725 (1990-11-01), Hinzen
patent: 5074276 (1991-12-01), Katayama
patent: 5111622 (1992-05-01), Steere

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