Metal fusion bonding – Process – With supplementary mechanical joining
Reexamination Certificate
2005-07-05
2005-07-05
Cooke, Colleen P. (Department: 1754)
Metal fusion bonding
Process
With supplementary mechanical joining
C228S173100, C228S180220, C228S255000, C438S678000
Reexamination Certificate
active
06913187
ABSTRACT:
A method of providing thermal vias in a printed circuit board that includes one or more layers of board material is disclosed. The vias provide for conducting heat from components mounted on the board. One or more holes (4) are provided in a printed circuit board that may include several metal layers. A metal ball (6) is inserted into each hole and subjected to pressure such as to deform said ball, and tightly fixating the resultant slug against the wall (5) of said hole. The deformed ball or slug fixed in the hole, which may have a metallised inner surface, functions to conduct heat and/or electricity between a metallised topside (2) and bottom side (3) of the printed circuit board and also between intermediate metallised layers in the case of a multi-layer board.
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Baker & Botts L.L.P.
Cooke Colleen P.
Infineon Technologies Wireless Solutions Sweden AB
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