Method and arrangement for attaching labels to semiconductor...

Details Method and arrangement for attaching labels to semiconductor... Method and arrangement for attaching labels to semiconductor...

2004-07-02

2008-03-04

Koch, George (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S556000, C156S559000, C156S566000

Reexamination Certificate

active

07338568

ABSTRACT:
A method and arrangement for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate is described which may shorten a process stream in an effort to reduce equipment costs. An exemplary arrangement may include at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate, and may include at least one turner configured to turn over the double-sided substrate to expose one of the first surface and second surface to the label attaching unit.

REFERENCES:
patent: 1873967 (1932-08-01), Klute
patent: 4009070 (1977-02-01), Linmans
patent: 4233105 (1980-11-01), Albinger
patent: 4881356 (1989-11-01), Beezer et al.
patent: 5158640 (1992-10-01), Akiyama
patent: 5984176 (1999-11-01), Koda et al.

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